Material Analysis Laboratory 1. Device Fabrication
Wedge Wire Bonder
| Model |
7476D-79 |
| Manufacturer (Country) |
West Bond |
| Purchase Date |
2013-07-03 |
| Purpose of Use |
Wire Bonding |
Product Description and Specifications
- Manual Wire Bonder
- Two way convertibility : Deep Access (90° wedge Ribbon) Conventional (45° wedge)
- Application : LD array PD array chip package MMIC hybrid IC etc...
- Control Logic : Motorola 68000 microprocessor
- Memory : battery back-up RAM
- Data Entry : Selector switch
- Z tool range : 0.5 inch
- Z encoder resolution : 0.002 inch
- Bond force range : Adjustable 10 to 150 grams
- Transducer : 1/2 wave 63 KHz (nominal)
- Throat reach : 5.125 inch
- Ultrasonics : Built-in 8 bit 4 watts (Ultrasonic positioning utility)
- Wire range : 0.7 to 2.0 mils 1×10 mil gold ribbon (7600D)
- ESD Protection : protection against electrostatic discharge
- Display : 4 line 40 character LCD
- Conventional tool length : 0.750 inch (7400D)
- Deep Access tool length : 0.750 inch (7600D)
- Micromanipulator : Dual counterbalanced single lever 8:1 ratio
- Wire spool mount : 0.5 inch with ball bearing rollers
- Radiant tool heat : Built-in
- Microscope : Selection available (ESD types available)
- Illuminator : Selection available (ESD types available)
- Wo가 holders : Wide selection plus custom fabrication services
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