INSTITUTE OF APPLIED PHYSICS

List

Material Analysis Laboratory 1. Device Fabrication

Wedge Wire Bonder

Model 7476D-79
Manufacturer (Country) West Bond
Purchase Date 2013-07-03
Purpose of Use Wire Bonding

Product Description and Specifications

  • Manual Wire Bonder
  • Two way convertibility : Deep Access (90° wedge Ribbon) Conventional (45° wedge)
  • Application : LD array PD array chip package MMIC hybrid IC etc...
  • Control Logic : Motorola 68000 microprocessor
  • Memory : battery back-up RAM
  • Data Entry : Selector switch
  • Z tool range : 0.5 inch
  • Z encoder resolution : 0.002 inch
  • Bond force range : Adjustable 10 to 150 grams
  • Transducer : 1/2 wave 63 KHz (nominal)
  • Throat reach : 5.125 inch
  • Ultrasonics : Built-in 8 bit 4 watts (Ultrasonic positioning utility)
  • Wire range : 0.7 to 2.0 mils 1×10 mil gold ribbon (7600D)
  • ESD Protection : protection against electrostatic discharge
  • Display : 4 line 40 character LCD
  • Conventional tool length : 0.750 inch (7400D)
  • Deep Access tool length : 0.750 inch (7600D)
  • Micromanipulator : Dual counterbalanced single lever 8:1 ratio
  • Wire spool mount : 0.5 inch with ball bearing rollers
  • Radiant tool heat : Built-in
  • Microscope : Selection available (ESD types available)
  • Illuminator : Selection available (ESD types available)
  • Woholders : Wide selection plus custom fabrication services
Wedge Wire Bonder